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Huawei plans 2 new AI chips for 2027 launch windows
The Indian Express··17 Sept
Huawei will launch two new AI semiconductors in 2027, rotating chairman David Wang said on Thursday. The 960DT is due in the first quarter and the Ascend 960PR in the third quarter. Wang said UnifiedBus underpins large systems and that superclusters can support up to 1 million AI processors. Huawei shipped more than 1,000 supernodes to more than 370 customers.
Prism
What It Means For You
- Buyers tracking Ascend roadmaps now have 2027 quarter targets for the 960DT and 960PR chips.
- Wang said Huawei's AI chip ecosystem had 5,270 monthly active developers.
- US export controls still limit China's access to some advanced chips and manufacturing tools.
What's Happening
- Wang spoke at a company event in Shanghai about connecting large numbers of AI chips.
- Huawei has developed 11 semiconductors based on UnifiedBus for large systems, he said.
- The company is building domestic AI computing capacity while competing with Nvidia.
How Huawei Links Chips
- UnifiedBus is meant to help chips share information inside large AI systems.
- Supernodes group many AI chips on one task; Wang did not detail chips per supernode.
- Washington's controls have pushed Chinese firms to link more locally available chips.
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