Technology
Samsung to use TSMC 3-nanometre dies for Nvidia HBM
Business Standard·
Samsung Electronics will use TSMC's 3-nanometre process for base dies in Nvidia's next custom high-bandwidth memory chips, the Seoul Economic Daily reported Sunday. Nvidia asked Samsung, SK Hynix and Micron to use TSMC for NVHBM base dies and sixth-generation DRAM for core dies. Samsung accepted after an internal review but will keep in-house production for standard HBM, the paper said.
Prism
What It Means For You
- Data centre buyers awaiting Nvidia AI servers depend on HBM supply from the three memory makers named.
- Samsung customers on standard HBM may see unchanged in-house lines while NVHBM uses TSMC, the report said.
- Chip investors track whether Samsung's own foundry could supplement TSMC if NVHBM demand exceeds capacity.
What's Happening
- NVHBM integrates Nvidia's memory controller into the base die, unveiled in August.
- The collaboration would be Samsung's first with TSMC at the HBM manufacturing stage.
- Industry sources cited by the newspaper described Nvidia's requirements across suppliers.
How NVHBM ties suppliers
- High-bandwidth memory stacks sit beside GPUs in AI accelerators.
- TSMC is the world's largest contract chip manufacturer based in Taiwan.
- The Seoul Economic Daily published the report on October 18.
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